Hafnia dons a new face

Hafnia dons a new face 05/16/2017 12:59 PM EDT As computer chips become smaller, faster and more powerful, their insulating layers must also be much more robust--currently a limiting factor for semiconductor technology. A collaborative University of Kentucky-Texas A&M University research team says this new phase of hafnia is an order of magnitude better at withstanding applied fields. Full story at https://uknow.uky.edu/research/hafnia-dons-new-face Source University of Kentucky This is an NSF News From the Field item.   Follow NSF:  This email was sent using GovDelivery, on behalf of: National Science Foundation Update · 4201 Wilson Boulevard · Arlington, VA 22230 · 703-292-5111