New approach to measuring stickiness could aid micro-device design

New approach to measuring stickiness could aid micro-device design 03/14/2018 02:30 PM EDT At the scale of microdevices, adhesion is one of the most important forces that engineers need to contend with. Brown University researchers have come up with a new way to measure it. Full story at https://news.brown.edu/articles/2018/03/mems Source Brown University This is an NSF News From the Field item. Follow NSF:  This email was sent using GovDelivery Communications Cloud on behalf of: National Science Foundation Update · 2415 Eisenhower Avenue, Alexandria, VA 22314 · 703-292-5111