05/16/2017 12:59 PM EDT
As computer chips become smaller, faster and more powerful, their insulating layers must also be much more robust--currently a limiting factor for semiconductor technology. A collaborative University of Kentucky-Texas A&M University research team says this new phase of hafnia is an order of magnitude better at withstanding applied fields. Source University of Kentucky
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Tuesday, May 16, 2017
Hafnia dons a new face
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